Electronic-device cooling system

A cooling system for directly cooling a plurality of electronic devices through immersion into a cooling liquid, the system comprising:

• a cooling tank having an open space defined by a bottom wall and side walls;
• a plurality of arrayed storage sections defined by a plurality of inner partitioning walls provided within the cooling tank to divide the open space, the storage sections being for storing at least one electronic device in each storage section;
• and
• an inflow opening and an outflow opening for the cooling liquid that are formed at each of the plurality of storage sections;
• wherein the inflow opening is formed at a bottom portion or a lateral surface of each storage section, and the outflow opening is formed in the vicinity of a liquid level of the cooling liquid flowing through each storage section;
• the cooling system further comprising:
• a boiling cooling device thermally connected to at least one heating element possessed by the at least one electronic device and enclosing a first cooling liquid having a boiling point T1;
• and
• a first heat exchanger enclosing a third refrigerant having a boiling point T3 (T3=T1 or T3<T1) being the same as the boiling point T1 of the first cooling liquid or being lower than the boiling point T1 of the first cooling liquid;
• wherein:
• each of the plurality of storage sections contains a second cooling liquid having a boiling point T2 (T2=T1 or T2>T1) being the same as the boiling point T1 of the first cooling liquid or being higher than the boiling point T1 of the first cooling liquid;
• the boiling cooling device and the at least one electronic device are immersed in the second cooling liquid within each storage section to be cooled directly;
• and
• the first heat exchanger is immersed in a surface layer portion of the second cooling liquid within each storage section.