Electronic device for liquid immersion cooling

A cooling apparatus including an electronic device that is immersed in a liquid coolant filled in a liquid immersion cooling apparatus, and directly cooled, the electronic device being configured to be housed in a housing part of the liquid immersion cooling apparatus, the electronic device comprising:

• a base board;
• a plurality of storage substrates to be arranged on at least one surface of the base board;
• a backplane including a plurality of connectors for electric connection of the respective storage substrates, the backplane being mounted orthogonally onto the one surface of the base board;
• a plurality of support plates that support the plurality of storage substrates, the plurality of support plates being fixed to the base board and the backplane;
• and
• a plurality of flash storage units mounted on the respective storage substrates, wherein:
• the backplane includes a combination of a plurality of backplane units arranged in a length direction of the base board, each of the backplane units including a signal connector and a power connector, the signal connector and the power connector being disposed separately for each of the backplane units, and
• the flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit;
• wherein the liquid immersion cooling apparatus includes a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using a plurality of internal partition walls in the cooling tank, and an inflow opening and an outflow opening for the liquid coolant, the inflow opening being formed in a bottom part or a side surface of each of the housing parts, and the outflow opening being formed around a surface of the liquid coolant circulating in the respective housing parts.