ACC Microelectronics Corporation
Santa Clara, CA, US· latest recorded location
ACC Microelectronics Corporation is named on 6 US grants and 0 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 6
- Published applications
- 0
- Inventors
- 6
- Granted in 2026 so far
- 0
- Most recent grant
- 1 Sep 1998
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
By publication year.
Technology areas
Share of 6 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- G05BControl or regulating systems in general1
- G05DSystems for controlling or regulating non-electric variables1
- G05FSystems for regulating electric or magnetic variables1
- G09GArrangements or circuits for control of indicating devices using static means to1
- H03KPulse technique1
Recent patents
- Chip package board having utility rings1 Sep 1998US 5,801,440 A
- Output mapping of die pad bonds in a ball grid array30 Dec 1997US 5,703,402 A
- Semiconductor board providing high signal pin utilization11 Nov 1997US 5,686,699 A
- Multi-voltage circuit arrangement and method for accommodating hybrid electronic system requirements16 Apr 1996US 5,508,653 A
- Display screen blanking using interactive video and user-interface monitoring5 Sep 1995US 5,448,262 A
No published applications.
Most cited
By later US patents
- Chip package board having utility rings215US 5,801,440 A1998
- Temperature control for a variable frequency CPU112US 5,422,806 A1995
- Semiconductor board providing high signal pin utilization56US 5,686,699 A1997
- Display screen blanking using interactive video and user-interface monitoring38US 5,448,262 A1995
- Output mapping of die pad bonds in a ball grid array29US 5,703,402 A1997