Output mapping of die pad bonds in a ball grid array

A chip package comprising:

• a substrate having a first surface and a second surface opposite said first surface;
• a plurality of sequentially numbered bond sites spaced apart from and surrounding said die-attach region on said first surface, each bond site being identified by an ordinal number representing the order of said bond site in said sequence of bond sites;
• a grid pattern defined on said second surface;
• and
• a first plurality of solder bumps disposed on said second surface and arranged along said grid pattern, each solder bump being identified by an ordinal number representing a sequential order of said solder bump in said grid pattern;
• each of said bond sites having a correspondence with one of said solder bumps such that the ordinal number of each bond site is the same as the ordinal number of said corresponding solder bump;
• a plurality of path means for providing an electrical paths between said bond sites and the corresponding solder bumps.

A chip carrier comprising:

• an electrically insulative member having first and second surfaces;
• a die-attach region disposed on said first surface;
• a plurality of traces formed on said first surface, said traces having first trace ends disposed in spaced relation to said die-attach region, at least some of said traces being signal traces, said first trace ends being linearly ordered, first trace ends of said signal traces being defined as signal trace ends and having positional numbers representing the position of said signal trace ends within said linearly ordered first trace ends;
• a plurality of solder balls formed on said second surface and arranged in a sequentially ordered grid pattern, at least some of said solder balls being signal solder balls, said signal solder balls being sequentially numbered based upon said sequentially ordered pattern, so that each said signal solder ball has a sequence number;
• and
• a plurality of electrically conductive vias formed through said insulative member;
• one of said signal traces having a correspondence to one of said signal solder balls such that the positional number of the signal trace end of said one signal trace is the same as the sequence number of said one signal solder ball;
• one of said plurality of vias being electrically connected to the second trace end of said one signal trace and being electrically connected to said one signal solder ball.