Y10T 428/12694
And next to cu- or fe-base component
Official title: and next to Cu- or Fe-base component
Y10T428/12694 (And next to cu- or fe-base component) appears on 83 US grants and 38 published applications in this corpus.
Search patents in Y10T- Granted patents
- 83
- Published applications
- 38
- Assignees
- 62
- Inventors
- 189
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 12 | 0 |
| 2001 | 9 | 2 |
| 2002 | 2 | 1 |
| 2003 | 2 | 2 |
| 2004 | 2 | 3 |
| 2005 | 2 | 4 |
| 2006 | 2 | 1 |
| 2007 | 3 | 7 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 3 | 2 |
| 2011 | 2 | 1 |
| 2012 | 3 | 0 |
| 2013 | 1 | 2 |
| 2014 | 0 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 2 |
| 2017 | 1 | 0 |
| 2018 | 1 | 2 |
| 2019 | 0 | 0 |
| 2020 | 2 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structure containing Sn layer or Sn alloy layer6 Jan 2026US 12,519,071 B2Ishihara Chemical Co., Ltd.
- Copper-alloy capping layers for metallization in touch-panel displays2 May 2023US 11,640,222 B2Materion Newton Inc.
- Copper-alloy capping layers for metallization in touch-panel displays19 Jul 2022US 11,392,257 B2Materion Newton Inc.
- Thin-film transistor and method of forming an electrode of a thin-film transistor9 Feb 2021US 10,916,569 B2H. C. Starck GmbH
- Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable17 Nov 2020US 10,842,058 B2JX Nippon Mining & Metals Corporation
- Electronic component with high coplanarity and method of manufacturing the same28 Mar 2024US 2024/0105670 A1Cyntec Co., Ltd.
- Structure containing sn layer or sn alloy layer9 Mar 2023US 2023/0072996 A1Ishihara Chemical Co., Ltd.
- Copper-alloy capping layers for metallization in touch-panel displays29 Sep 2022US 2022/0308705 A1Materion Newton Inc.
- Copper-alloy capping layers for metallization in touch-panel displays8 Jul 2021US 2021/0208738 A1Materion Newton Inc.
- Copper-alloy capping layers for metallization in touch-panel displays21 Jun 2018US 2018/0175075 A1H. C. Starck GmbH
Most cited
By later US patents
- Optical articles comprising isosorbide polyesters and method for making same93US 6,126,992 AE. I. DuPont de Nemours and Company · 2000
- Composite coating for electrical connectors48US 5,028,492 AOlin Corporation · 1991
- Printed circuit material39US 4,503,112 AOak Industries Inc. · 1985
- Printed circuit material38US 4,394,419 AOak Industries Inc. · 1983
- Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix35US 6,326,685 B1Agere Systems Guardian Corp. · 2001