Electronic component with high coplanarity and method of manufacturing the same
AssigneeCyntec Co., Ltd.
InventorChi-Hung Su
Life of this patent
Estimating the term…
Abstract
An electronic component with high coplanarity, including a body with a functional circuit and a mounting plane, a first electrode with a first area deposited on the mounting plane, and a second electrode with a second area deposited on the mounting plane, wherein the first area is larger than the second area, and the first electrode and the second electrode includes a conductive layer and at least one first plating layer over the conductive layer, and a thickness of the conductive layer of the first electrode is smaller than a thickness of the conductive layer of the second electrode, and a thickness of the first plating layer of the first electrode is larger than a thickness of the first plating layer of the second electrode.
Claims25
An electronic component with high coplanarity, comprising:
- a body with a functional circuit and a mounting plane;
- a first electrode with a first area deposited on said mounting plane;
- and
- a second electrode with a second area deposited on said mounting plane, wherein said first area is larger than said second area;
- wherein said first electrode and said second electrode comprise a conductive layer and at least one first plating layer over said conductive layer, and a thickness of said conductive layer of said first electrode is smaller than a thickness of said conductive layer of said second electrode, and a thickness of said first plating layer of said first electrode is larger than a thickness of said first plating layer of said second electrode.
An electronic component with high coplanarity, comprising:
- a body with a functional circuit and a mounting plane;
- a first electrode on said mounting plane with a first area;
- a second electrode on said mounting plane with a second area, wherein said first area is larger than said second area;
- and
- a groove on said mounting plane connecting said first electrode and said second electrode;
- wherein said first electrode and said second electrode comprise a conductive layer and at least one first plating layer over said conductive layer, and a thickness of said conductive layer of said first electrode is substantially equal to a thickness of said conductive layer of said second electrode, and a thickness of said first plating layer of said first electrode is substantially equal to a thickness of said first plating layer of said second electrode.
A method of manufacturing an electronic component with high coplanarity, comprising:
- providing a body with a mounting plane;
- forming a conductive layer on said mounting plane of said body, wherein said conductive layer comprises a first electrode pattern and a second electrode pattern, and a first area of said first electrode pattern is larger than a second area of said second electrode pattern, and a thickness of said first electrode pattern is smaller than a thickness of said second electrode pattern;
- and
- simultaneously forming at least one first plating layer over said first electrode pattern and said second electrode pattern of said conductive layer, wherein a thickness of said first plating layer over said first electrode pattern is larger than a thickness of said first plating layer over said second electrode pattern.
Dependencies are inferred from the claim text.