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US 10,842,058 B2Granted
Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
AssigneeJX Nippon Mining & Metals Corporation
InventorKoichiro Tanaka
Life of this patent
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Abstract
A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 μm, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 μmol/dm2, and a total adhesion amount of the B element group is 40 to 900 μmol/dm2.
Claims17
A metal foil for electromagnetic shielding, comprising:
- a metal foil base having a thickness exceeding 4 μm, an alloy layer having an A element comprising Sn and a B element selected from the group consisting of Ag, Ni, Fe, Co and combinations thereof, formed on one or both surfaces of the metal foil base, and an underlayer comprising a B element selected from the group consisting of Ag, Ni, and Co, wherein the underlayer is formed between the alloy layer and the metal foil base, wherein
- a total adhesion amount of the A element per surface is 10 to 300 μmol/dm2, and a total adhesion amount of the B element per surface is 40 to 900 μmol/dm2,
- and wherein an oxide layer having a thickness between 1 and 50 nm and comprising the A element is formed on the outermost surface of the alloy layer.
Dependencies are inferred from the claim text.