Y10T 428/12222
Shaped configuration for melting [e.g., package, etc.]
Y10T428/12222 (Shaped configuration for melting [e.g., package, etc.]) appears on 122 US grants and 110 published applications in this corpus.
Search patents in Y10T- Granted patents
- 122
- Published applications
- 110
- Assignees
- 102
- Inventors
- 370
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 9 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 1 |
| 2003 | 3 | 2 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 3 |
| 2007 | 1 | 4 |
| 2008 | 1 | 9 |
| 2009 | 2 | 9 |
| 2010 | 7 | 11 |
| 2011 | 4 | 24 |
| 2012 | 10 | 11 |
| 2013 | 9 | 10 |
| 2014 | 7 | 12 |
| 2015 | 7 | 3 |
| 2016 | 5 | 1 |
| 2017 | 5 | 1 |
| 2018 | 1 | 1 |
| 2019 | 2 | 1 |
| 2020 | 2 | 0 |
| 2021 | 2 | 0 |
| 2022 | 0 | 3 |
| 2023 | 0 | 2 |
| 2024 | 2 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Atomic layer deposition (ALD) for multi-layer ceramic capacitors (MLCCs)27 Jan 2026US 12,533,726 B2Forge Nano, Inc.
- Holed ingot improving a line productivity30 Jul 2024US 12,048,963 B2ArcelorMittal
- Notched ingot improving a line productivity11 Jun 2024US 12,005,496 B2ArcelorMittal
- Multi-layered aluminum strip for brazing, brazing component, manufacturing method and heat exchanger and use23 Feb 2021US 10,926,361 B2Mahle International GmbH
- Soldering material12 Jan 2021US 10,888,957 B2Senju Metal Industry Co., Ltd.
- Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (MLCCs)23 Nov 2023US 2023/0374659 A1Forge Nano, Inc.
- Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (MLCCs)6 Apr 2023US 2023/0104924 A1Forge Nano, Inc.
- Reinforcing member for cold forming and parts manufactured using same15 Dec 2022US 2022/0395886 A1Posco
- Notched ingot improving a line productivity6 Oct 2022US 2022/0314308 A1ArcelorMittal
- Holed ingot improving a line productivity11 Aug 2022US 2022/0250139 A1ArcelorMittal
Most cited
By later US patents
- Process for the preparation of surface modified solid substrates59US 5,213,898 ANorsk Hydro A/S · 1993
- Method and apparatus for soldering electric terminals to double-sided circuit boards34US 4,050,621 ABunker Ramo Corporation · 1977
- Enhanced ceramic ball grid array using in-situ solder stretch with spring33US 5,968,670 AInternational Business Machines Corporation · 1999
- Method for fabricating large dimension bonds using reactive multilayer joining33US 7,810,704 B2Nanofoil Corporation · 2010
- Method for casting composite ingot29US 7,472,740 B2Novelis Inc. · 2009