Soldering material

A soldering material comprising:

• a spherical core that provides a space between a joining object and an object to be joined, wherein the core comprises at least one element selected from the group consisting of Cu, Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, and Mg, or a resin material;
• and
• a covering layer coating the core and comprising Sn or a solder alloy primarily including Sn, wherein the Sn content of the covering layer is equal to or greater than 90 mass %,
• the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. set in a room with a temperature of 25° C. and 40% humidity,
• the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.