Y10T 428/12188
Having marginal feature for indexing or weakened portion for severing
Official title: having marginal feature for indexing or weakened portion for severing
Y10T428/12188 (Having marginal feature for indexing or weakened portion for severing) appears on 88 US grants and 28 published applications in this corpus.
Search patents in Y10T- Granted patents
- 88
- Published applications
- 28
- Assignees
- 67
- Inventors
- 151
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 3 |
| 2003 | 2 | 1 |
| 2004 | 3 | 5 |
| 2005 | 3 | 1 |
| 2006 | 2 | 0 |
| 2007 | 1 | 1 |
| 2008 | 1 | 3 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 2 | 3 |
| 2012 | 2 | 1 |
| 2013 | 2 | 0 |
| 2014 | 1 | 1 |
| 2015 | 1 | 3 |
| 2016 | 3 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 2 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Predetermined breaking body for a shaft of a machine, shaft having a predetermined breaking body, and machine having a shaft of this type21 Jul 2026US 12,687,203 B2Bayerische Motoren Werke Aktiengesellschaft
- Folding metal back plate21 Nov 2023US 11,825,621 B2Darwin Precisions Corporation
- Copper foil with carrier19 Sep 2023US 11,765,840 B2Mitsui Mining & Smelting Co., Ltd.
- Laminated member, laminated body, and motor18 Jan 2022US 11,225,049 B2Panasonic Corporation
- Method of making strip formed by web-connected wires6 Dec 2016US 9,511,413 B2Cent & Cent GmbH & Co. KG
- Predetermined Breaking Body for a Shaft of a Machine, Shaft Having a Predetermined Breaking Body, and Machine Having a Shaft of This Type21 Nov 2024US 2024/0384763 A1Bayerische Motoren Werke Aktiengesellschaft
- Folding metal back plate17 Nov 2022US 2022/0369485 A1Darwin Precisions Corporation
- Copper foil with carrier25 Feb 2021US 2021/0059057 A1Mitsui Mining & Smelting Co., Ltd.
- Laminated member, method for manufacturing same, laminated body, and motor4 Jul 2019US 2019/0202175 A1Panasonic Corporation
- Methods of forming fragmentation bodies, warheads, and ordnance20 Aug 2015US 2015/0233688 A1Orbital ATK, Inc.
Most cited
By later US patents
- Leadframe adapted to support semiconductor elements192US 5,391,439 ADai Nippon Printing Co.Ltd. · 1995
- Stent forming apparatus with stent deforming blades181US 5,906,759 AMedinol Ltd. · 1999
- Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor82US 4,451,973 AMatsushita Electronics Corporation · 1984
- Pad including heat sink and thermal insulation area66US 5,800,905 AATD Corporation · 1998
- Stent fabrication method and apparatus60US 6,299,755 B1Medinol Ltd. · 2001