Y10T 29/53252
Means to simultaneously fasten three or more parts
Y10T29/53252 (Means to simultaneously fasten three or more parts) appears on 149 US grants and 102 published applications in this corpus.
Search patents in Y10T- Granted patents
- 149
- Published applications
- 102
- Assignees
- 95
- Inventors
- 259
- Latest grant
- 23 May 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 3 |
| 2002 | 6 | 7 |
| 2003 | 3 | 6 |
| 2004 | 12 | 14 |
| 2005 | 9 | 12 |
| 2006 | 7 | 9 |
| 2007 | 11 | 4 |
| 2008 | 8 | 3 |
| 2009 | 5 | 9 |
| 2010 | 5 | 4 |
| 2011 | 9 | 4 |
| 2012 | 7 | 3 |
| 2013 | 4 | 3 |
| 2014 | 5 | 4 |
| 2015 | 1 | 4 |
| 2016 | 3 | 4 |
| 2017 | 2 | 2 |
| 2018 | 2 | 4 |
| 2019 | 5 | 1 |
| 2020 | 4 | 2 |
| 2021 | 1 | 0 |
| 2022 | 2 | 0 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Holding frame comprising a fixing element held in a movable manner23 May 2023US 11,658,437 B2HARTING Electric GmbH & Co. KG
- Apparatus for spatial and temporal control of temperature on a substrate12 Apr 2022US 11,302,556 B2Lam Research Corporation
- Method for assembling and installing a wire bundle assembly group25 Jan 2022US 11,232,887 B2The Boeing Company
- Flip chip bonding device and bonding method26 Jan 2021US 10,903,105 B2Shanghai Micro Electronics Equipment (Group) Co., Ltd.
- Method of mounting a module to a land grid array (LGA)10 Nov 2020US 10,834,860 B2International Business Machines Corporation
- Apparatus for spatial and temporal control of temperature on a substrate6 Aug 2020US 2020/0251370 A1Lam Research Corporation
- Flip chip bonding device and bonding method9 Jan 2020US 2020/0013656 A1Shanghai Micro Electronics Equipment (Group) Co., Ltd.
- Method and system for assembling and installing a wire bundle assembly group24 Jan 2019US 2019/0027279 A1The Boeing Company
- Module installation alignment device15 Nov 2018US 2018/0332747 A1International Business Machines Corporation
- Holding frame comprising a fixing element held in a movable manner20 Sep 2018US 2018/0269621 A1HARTING Electric GmbH & Co. KG
Most cited
By later US patents
- Hand operated press for installing cable connectors58US 6,272,738 B12001
- Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same45US 4,127,432 AMatsushita Electric Industrial Co., Ltd. · 1978
- Apparatus for mounting chip type circuit elements on a printed circuit board36US 4,292,116 ATokyo Denki Kagaku Kogyo Kabushiki Kaisha · 1981
- Method for mounting components and apparatus therefor35US 5,741,114 AYamaha Hatsudoki Kabushiki Kaisha · 1998
- Apparatus for docking a printed circuit board31US 7,297,015 B1International Business Machines Corporation · 2007