Method for mounting components and apparatus therefor
AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorHitoshi Onodera
Life of this patent
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Abstract
A component mounting device adapted to mount components such IC or the like on a printed circuit board that includes replaceable pick up nozzles to accommodate different types of components to be picked up. A sensing station is provided that permits the pick up nozzle to be verified as the correct one. The same sensing station is employed to sense both the orientation of a component that is picked up and also whether the component is correctly oriented for deposit. This is done by measuring projected lengths in a plane with a photo sensitive device and by making calculations in accordance with trigonometric relationships.
Claims75
A component handling apparatus adapted to pick and position components comprising a pick up portion for picking up, transporting, and depositing components, a sensing station adapted to sense a condition of an article, means for positioning said pick up portion in said sensing station for recognition of the identity of the pick up portion independently of a component which may be held by said pick up portion and means for positioning a component held by said pick up portion in said sensing station for detecting a condition of the component.
A component handling method for picking up and positioning components if permissible with a pick up portion carried by a device, comprising the steps of recognizing the identity of said pick up portion by a sensor and thereafter determining if a component may be picked up picking up a component if it is determined if the component may be picked up, and subsequently detecting a condition of a component by the sensor if a component is picked up.
Dependencies are inferred from the claim text.