Flip chip bonding device and bonding method

A flip-chip bonding device, comprising:

• a supply unit configured to separate a flip-chip from a carrier and to supply the flip-chip, the supply unit comprising a separation device configured to separate the flip-chip from the carrier and a flipping device configured to pick up and flip over the flip-chip separated from the carrier so that the flip-chip is turned downside up;
• a transfer unit configured to receive and retain the flip-chip turned downside up from the flipping device, the transfer unit being configured to retain multiple flip-chips received from the flipping device;
• a bonding unit configured to simultaneously bond the multiple flip-chips on the transfer unit onto a substrate;
• a transportation unit configured to transport the transfer unit in a horizontal X-direction from the supply unit to the bonding unit;
• and
• a position adjustment unit configured to measure the positions of the multiple flip-chips retained on the transfer unit and adjust positions of the multiple flip-chips during the transportation of the transfer unit from the supply unit to the bonding unit, the position adjustment unit comprising a position adjustment device configured to absorb the flip-chips and adjust the positions of the flip-chips on the transfer unit to ensure a high positional accuracy of the flip-chips when bonded to the substrate by the bonding unit;
• a control unit configured to control movements of the supply unit, transfer unit, position adjustment unit, bonding unit, and transportation unit,
• wherein the supply unit, the position adjustment unit and the bonding unit are disposed sequentially along the horizontal X-direction.