Y10T 29/49091
With direct compression of powdered insulation
Official title: with direct compression of powdered insulation
Y10T29/49091 (With direct compression of powdered insulation) appears on 33 US grants and 11 published applications in this corpus.
Search patents in Y10T- Granted patents
- 33
- Published applications
- 11
- Assignees
- 24
- Inventors
- 43
- Latest grant
- 21 Aug 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 3 |
| 2003 | 3 | 1 |
| 2004 | 1 | 3 |
| 2005 | 0 | 0 |
| 2006 | 2 | 1 |
| 2007 | 1 | 0 |
| 2008 | 2 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate21 Aug 2012US 8,247,703 B2Endicott Interconnect Technologies, Inc.
- Method of making circuitized substrate with a resistor18 Jan 2011US 7,870,664 B2Endicott Interconnect Technologies, Inc.
- Fabricating heating elements30 Dec 2008US 7,470,394 B2Design Dynamics Limited
- Process for manufacturing a composite polymeric circuit protection device18 Mar 2008US 7,343,671 B2Tyco Electronics Corporation
- Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate26 Jun 2007US 7,235,745 B2Endicott Interconnect Technologies, Inc.
- Glow plug20 Nov 2014US 2014/0339214 A1
- Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate24 Feb 2011US 2011/0043987 A1Endicott Interconnect Technologies, Inc.
- Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate26 Jun 2008US 2008/0151515 A1Endicott Interconnect Technologies, Inc.
- Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate13 Jul 2006US 2006/0151202 A1Endicott Interconnect Technologies, Inc.
- Glow plug,glow plug mounting structure, and glow plug manufacturing method30 Sep 2004US 2004/0188408 A1Ngk Spark Plug Co., Ltd.
Most cited
By later US patents
- Method of fabricating thermocouple cable and the cable resulting therefrom18US 5,111,002 AOmega Engineering, Inc. · 1992
- Method of making electric heater16US 4,112,577 AGeneral Motors Corporation · 1978
- Heater unit16US 4,349,727 ASouthport Enterprises, Inc. · 1982
- Electric heater -method of making15US 4,281,451 AGeneral Motors Corporation · 1981
- Electric cartridge heater15US 4,593,182 AHotset Heizpatronen und Zubehor GmbH · 1986