Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate

An electrical assembly comprising:

• a circuitized substrate including a first dielectric layer, first and second electrical conductors spacedly positioned on said first dielectric layer, a quantity of material on said first dielectric layer in contact with said first and second electrical conductors, said quantity of material including a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component, said first and second electrical conductors and said quantity of material being a circuit line, said quantity of material being a resistor for said circuit line;
• and at least one electrical component positioned on and electrically coupled to said circuitized substrate.

An information handling system comprising:

• a housing:
• a circuitized substrate positioned substantially within said housing and including a first dielectric layer, first and second electrical conductors spacedly positioned on said first dielectric layer, a quantity of material on said first dielectric layer in contact with said first and second electrical conductors, said quantity of material including a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component, said first and second electrical conductors and said quantity of material being a circuit line, said quantity of material being a resistor for said circuit line;
• and at least one electrical component positioned on and electrically coupled to said circuitized substrate.