Method of making circuitized substrate with a resistor

A method of making a circuitized substrate comprising:

• a) providing a first dielectric layer;
• b) spacedly positioning first and second electrical conductors on said first dielectric layer;
• c) positioning a quantity of resistor material on said first dielectric layer in contact with said first and second electrical conductors, said quantity of resistor material including a polymer resin and a quantity of non-fired nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, said nano-powders having a particle size within the range of from about 0.01 micron to about 0.9 micron and a surface area within the range of from about 2 to about 20 square meters per gram, said particles of said metal component including a coating of said polymer resin thereon such that said metal particles do not form a single continuous conductive path through said resistor material;
• and
• d) positioning a second dielectric layer over said first and second electrical conductors and said quantity of resistor material, wherein said quantity of resistor material comprises an internal resistor within said substrate.