Y10T 29/303
With assembling or disassembling of a pack
Official title: with assembling or disassembling of a pack
Y10T29/303 (With assembling or disassembling of a pack) appears on 41 US grants and 15 published applications in this corpus.
Search patents in Y10T- Granted patents
- 41
- Published applications
- 15
- Assignees
- 32
- Inventors
- 67
- Latest grant
- 2 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 4 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 4 |
| 2016 | 1 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method for inflating micro-channels2 Jan 2024US 11,858,809 B2Taiyuan University of Technology
- Method for manufacturing substrate gap supporter29 Aug 2017US 9,748,023 B2Gne Tech Co., Ltd.
- Substrate gap supporter and method for manufacturing same5 Apr 2016US 9,305,684 B2Gne Tech Co., Ltd.
- Method for producing a pricking element3 Jan 2012US 8,087,141 B2Roche Diagnostics Operations, Inc.
- Microneedle array device and its fabrication method11 May 2010US 7,712,198 B2Industrial Technology Research Institute
- Method for inflating micro-channels23 Sep 2021US 2021/0292159 A1Taiyuan University of Technology
- Manufacturing method for circuit structure embedded with electronic device17 Dec 2015US 2015/0366081 A1Unimicron Technology Corp.
- Substrate for semiconductor packaging and method of forming same3 Dec 2015US 2015/0348895 A1Pbt Pte. Ltd.
- Method for manufacturing substrate gap supporter3 Dec 2015US 2015/0351248 A1Gne Tech Co., Ltd.
- Multi-piece wiring board and method for producing the same26 Nov 2015US 2015/0342049 A1KYOCERA Circuit Solutions, Inc.
Most cited
By later US patents
- Method for reducing thickness of a high-strength low-ductility metal foil on thin strip element89US 5,222,282 ATexas Instruments Incorporated · 1993
- Method for making devices having intermetallic structures and intermetallic devices made thereby75US 6,672,502 B1State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University · 2004
- Method for fabricating .sup.99 Mo production targets using low enriched uranium, .sup.99 Mo production targets comprising low enriched uranium47US 6,160,862 AThe United States of America as represented by the United States Department of Energy · 2000
- Method for fabricating .sup.99 Mo production targets using low enriched uranium, .sup.99 Mo production targets comprising low enriched uranium39US 5,615,238 AThe United States of America as represented by the United States Department of Energy · 1997
- Metal heat insulator38US 5,424,139 ALydall, Inc. · 1995