Multi-piece wiring board and method for producing the same
AssigneeKYOCERA Circuit Solutions, Inc.
InventorsTomoharu TSUCHIDA, Kazuki OKA, Daichi OHMAE
Life of this patent
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Abstract
The multi-piece, wiring board according to the embodiment of the present invention includes a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions, and a wiring board formed on the upper surface of the bottom plate in. each of the product forming regions, the: wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and a wiring conductor formed on the insulating layer.
Claims16
A multi-piece wiring board comprising:
- a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions;
- and
- a wiring board formed on the upper surface of the bottom plate in each of the product forming regions, the wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and
- a wiring conductor formed on the insulating layer.
A method for producing a multi-piece wiring board, the method comprising the steps of:
- forming an insulating layer covering at least each of product forming regions on an upper surface of a bottom plate having a plurality of the product forming regions on the upper surface;
- forming a wiring conductor on the insulating layer of each of the product forming regions;
- exposing the upper surface of the bottom plate by removing the insulating layer formed in a region other than each of the product forming regions;
- and
- forming a frame portion configured to divide the upper surface of the bottom plate into each of the product forming regions on the bottom plate by depositing a plated conductor layer on the upper surface of the exposed bottom plate.
A multi-piece wiring board comprising:
- a supporting board including metal foil laminated on an upper surface of a bottom plate in a state where at least a central portion of the metal foil is peelable from the bottom plate;
- a frame portion including a plated metal layer, the frame portion configured to divide a central portion of an upper surface of the metal foil into a plurality of product forming regions in the central portion of the upper surface of the metal foil, the frame portion formed on the metal foil;
- and
- a wiring board formed in each of the product forming regions, the wiring board including
- an insulating layer formed so as to be in close contact with an inner wall of the product forming region, and
- a wiring conductor formed on the insulating layer.
A method for producing a multi-piece wiring board, the method comprising the steps of:
- laminating metal foil including a plurality of product forming regions in a central portion of an upper surface of the metal foil on an upper surface of a bottom plate in a state where at least the central portion is peelable from the bottom plate;
- forming an insulating layer on the entire surface of at least the central portion on the metal foil;
- forming a wiring conductor on the insulating layer of each of the product forming regions;
- forming a groove portion configured to expose the upper surface of the metal foil by removing the insulating layer formed in a region other than each of the product forming regions;
- and
- forming a frame portion including a plated conductor layer in close contact with a side surface of the insulating layer of each of the product forming regions by depositing the plated conductor layer in the groove portion.
Dependencies are inferred from the claim text.