Substrate for semiconductor packaging and method of forming same

A substrate for semiconductor packaging, the substrate comprising:

• a carrier;
• a plurality of external pads formed on the carrier, the external pads formed on the carrier defining a first conductive layer;
• a first insulating layer formed on the carrier with a molding compound, wherein the first conductive layer is embedded in the first insulating layer;
• and
• one or more of a plurality of bond pads, a plurality of conductive traces and a plurality of microvias formed on the first conductive layer, the one or more of the bond pads, the conductive traces and the microvias formed on the first conductive layer defining a second conductive layer.

A semiconductor package, comprising:

• a plurality of external pads, the external pads defining a first conductive layer;
• a first insulating layer formed with a molding compound, wherein the first conductive layer is embedded in the first insulating layer;
• one or more of a die pad, a plurality of bond pads, a plurality of conductive traces and a plurality of microvias formed on the first conductive layer, the one or more of the die pad, the bond pads, the conductive traces and the microvias formed on the first conductive layer defining a second conductive layer;
• a semiconductor chip attached to one of the external pads and the die pad;
• a plurality of wires electrically connecting the semiconductor chip to the bond pads;
• and
• an encapsulant encapsulating the semiconductor chip, the wires and the bond pads.