Y10T 156/109
Embedding of laminae within face of additional laminae
Y10T156/109 (Embedding of laminae within face of additional laminae) appears on 416 US grants and 207 published applications in this corpus.
Search patents in Y10T- Granted patents
- 416
- Published applications
- 207
- Assignees
- 262
- Inventors
- 708
- Latest grant
- 6 Oct 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 12 | 0 |
| 1978 | 12 | 0 |
| 1979 | 4 | 0 |
| 1980 | 9 | 0 |
| 1981 | 10 | 0 |
| 1982 | 10 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 9 | 0 |
| 1997 | 16 | 0 |
| 1998 | 20 | 0 |
| 1999 | 13 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 5 |
| 2002 | 20 | 24 |
| 2003 | 13 | 9 |
| 2004 | 14 | 15 |
| 2005 | 7 | 10 |
| 2006 | 9 | 5 |
| 2007 | 10 | 12 |
| 2008 | 6 | 15 |
| 2009 | 6 | 20 |
| 2010 | 14 | 17 |
| 2011 | 20 | 24 |
| 2012 | 21 | 15 |
| 2013 | 16 | 11 |
| 2014 | 14 | 8 |
| 2015 | 9 | 8 |
| 2016 | 4 | 2 |
| 2017 | 5 | 3 |
| 2018 | 2 | 1 |
| 2019 | 4 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus configured as a structure comprising a skin including a bond without a splice plate6 Oct 2020US 10,793,250 B2The Boeing Company
- Fabricating embedded fragmentation cases for anti-personnel mines10 Sep 2019US 10,408,589 B1The United States of America as represented by the Secretary of the Army
- Transfer for application to a surface11 Jun 2019US 10,315,402 B2Conductive Transfers Limited
- Buttress brachytherapy and integrated staple line markers for margin identification21 May 2019US 10,293,553 B2Covidien LP
- Partial encapsulation of stents26 Feb 2019US 10,213,328 B2Bard Peripheral Vascular, Inc.
- Transfer for Application to a Surface23 Mar 2023US 2023/0090227 A1Conductive Transfers Limited
- Transfer for Application to a Surface19 Sep 2019US 2019/0283386 A1Conductive Transfers Limited
- Coatings containing functionalized graphene sheets and articles coated therewith27 Jun 2019US 2019/0194477 A1The Trustees of Princeton University
- Transfer for Application to a Surface3 May 2018US 2018/0117895 A1Global Print Solutions Limited
- Chip card substrate and method of forming a chip card substrate31 Aug 2017US 2017/0246844 A1Infineon Technologies AG
Most cited
By later US patents
- Buttress brachytherapy and integrated staple line markers for margin identification824US 10,293,553 B2Covidien LP · 2019
- Partial encapsulation of stents294US 6,398,803 B1IMPRA, Inc., a subsidiary of C. R. Bard, Inc. · 2002
- Thermoformed apparatus having a communications device174US 6,943,678 B2Nextreme, LLC · 2005
- Method of manufacturing a three-dimensional plastic article168US 5,173,220 AMotorola, Inc. · 1992
- Circuit component built-in module and method for producing the same156US 6,038,133 AMatsushita Electric Industrial Co., Ltd. · 2000