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US 10,315,402 B2Granted
Transfer for application to a surface
AssigneeConductive Transfers Limited
InventorsPaul Timothy Brook, Raymond Bungay, Melvyn Revitt
Life of this patent
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Abstract
A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.
Claims17
A conductive transfer for application to a surface, comprising:
- a first non-conductive printed ink layer and a second non-conductive printed ink layer;
- an electrically conductive printed ink layer positioned between said first non-conductive printed ink layer and said second non-conductive printed ink layer, said electrically conductive printed ink layer forming part of an electrical circuit;
- and
- an adhesive layer for adhering said conductive transfer to a surface;
- wherein
- said first non-conductive printed ink layer comprises separate portions over a given cross-section of said first non-conductive printed ink layer which produce an opening in said first non-conductive printed ink layer;
- and
- said electrically conductive printed ink layer is encapsulated by said first non-conductive printed ink layer and said second non-conductive printed ink layer over a first area produced by said separate portions and exposed at said opening to provide an electrical contact point in a second area to enable a connection to be made to said electrical circuit.
5 more elements
A method of producing a conductive transfer for application to a surface, comprising the steps of:
- printing a non-conductive ink onto a substrate to produce a first non-conductive printed ink layer;
- curing said first non-conductive printed ink layer;
- printing an electrically conductive ink onto said first non-conductive printed ink layer to produce an electrically conductive printed ink layer forming part of an electrical circuit;
- curing said electrically conductive printed ink layer;
- printing said non-conductive ink over said electrically conductive printed ink layer to produce a second non-conductive printed ink layer;
- curing said second non-conductive printed ink layer;
- printing an adhesive material over said second non-conductive ink layer to produce an adhesive layer;
- and
- curing said adhesive layer;
- wherein
- said step of printing said first non-conductive printed ink layer comprises printing separate portions for a given cross section of said first non-conductive printed ink layer which produce an opening in said first non-conductive printed ink layer;
- said steps of printing said non-conductive ink and said electrically conductive ink encapsulates said electrically conductive printed ink layer between said first non-conductive printed ink layer and said second non-conductive printed ink layer over a first area produced by said separate portions;
- and
- said step of printing said non-conductive ink over said electrically conductive printed ink layer creates an exposed second area which provides an electrical contact point to enable a connection to be made to said electrical circuit.
11 more elements
Dependencies are inferred from the claim text.