Y10T 156/107
Punching and bonding pressure application by punch
Y10T156/107 (Punching and bonding pressure application by punch) appears on 199 US grants and 79 published applications in this corpus.
Search patents in Y10T- Granted patents
- 199
- Published applications
- 79
- Assignees
- 128
- Inventors
- 367
- Latest grant
- 11 Oct 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 6 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 10 | 0 |
| 2001 | 6 | 3 |
| 2002 | 3 | 7 |
| 2003 | 11 | 4 |
| 2004 | 2 | 8 |
| 2005 | 1 | 5 |
| 2006 | 3 | 4 |
| 2007 | 5 | 8 |
| 2008 | 4 | 9 |
| 2009 | 6 | 6 |
| 2010 | 9 | 2 |
| 2011 | 8 | 5 |
| 2012 | 7 | 2 |
| 2013 | 2 | 2 |
| 2014 | 4 | 1 |
| 2015 | 1 | 7 |
| 2016 | 2 | 1 |
| 2017 | 4 | 0 |
| 2018 | 3 | 2 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 2 | 1 |
| 2022 | 2 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Device for manufacturing laminated iron core and method for manufacturing laminated iron core11 Oct 2022US 11,469,651 B2Mitsui High-Tec, Inc.
- Applicator for die-cut parts and method for applying die-cut parts to surfaces, and a die-cut part strip1 Mar 2022US 11,260,644 B2Tesa SE
- Apparatus and method for bonding sheet metal parts to a laminated core20 Jul 2021US 11,065,858 B2voestalpine Automotive Components Dettingen GmbH & Co. KG
- System for applying interface materials25 May 2021US 11,014,203 B2
- Automatic systems and methods for stacking composite plies10 Mar 2020US 10,583,617 B2General Electric Company
- Device for manufacturing laminated iron core and method for manufacturing laminated iron core25 Mar 2021US 2021/0091644 A1Mitsui High-Tec, Inc.
- Applicator for die-cut parts and method for applying die-cut parts to surfaces, and a die-cut part strip2 Jan 2020US 2020/0001589 A1Tesa SE
- Apparatus and method for bonding sheet metal parts to a laminated core26 Sep 2019US 2019/0291403 A1voestalpine Automotive Components Dettingen GmbH & Co. KG
- Automatic systems and methods for stacking composite plies31 May 2018US 2018/0147795 A1General Electric Company
- Systems and methods of applying thermal interface materials11 Jan 2018US 2018/0009072 A1Laird Technologies, Inc.
Most cited
By later US patents
- Pouch with pour spout107US 4,378,069 AMagna Technologies, Inc. · 1983
- High k dielectric capacitor with low k sheathed signal vias83US 6,072,690 AInternational Business Machines Corporation · 2000
- Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer82US 4,906,314 AMicron Technology, Inc. · 1990
- Method for inflating a fluid-filled chamber76US 8,241,450 B2NIKE, Inc. · 2012
- Method of producing labels each having a circuit forming an oscillating circuit73US 4,900,386 ADurgo AG · 1990