Systems and methods of applying thermal interface materials
AssigneeLaird Technologies, Inc.
InventorsMark D. Kittel, Jason L. Strader
Life of this patent
Estimating the term…
Abstract
Disclosed are exemplary embodiments of systems and methods of applying thermal interface materials (TIMs). The thermal interface materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.
Claims29
1-20. (canceled)
A system for applying thermal interface materials to components, the system comprising:
- a supply of thermal interface material;
- and
- a tool operable for pushing against and/or removing a portion of the thermal interface material that is between the tool and a corresponding one of the components, whereby the portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components without diffusion bonding of the portion of the thermal interface material to the corresponding one of the components.
A method of applying thermal interface materials to components, the method comprising tamping and removing a portion of a thermal interface material from a supply of the thermal interface material that is aligned with a corresponding one of the components such that the portion of the thermal interface material is applied to the corresponding one of the components without diffusion bonding of the portion of the thermal interface material to the corresponding one of the components.
A system for applying interface materials to components, the system comprising:
- a supply of interface material;
- and
- a tool operable for tamping and severing a portion of the interface material that is between the tool and a corresponding one of the components, whereby the portion of the interface material tamped and severed from the supply is applied to the corresponding one of the components without diffusion bonding of the portion of the interface material to the corresponding one of the components.
Dependencies are inferred from the claim text.