Y10S 83/953
With work support
Official title: with work support
Y10S83/953 (With work support) appears on 46 US grants and 6 published applications in this corpus.
Search patents in Y10S- Granted patents
- 46
- Published applications
- 6
- Assignees
- 28
- Inventors
- 54
- Latest grant
- 10 Apr 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 1 |
| 2003 | 2 | 0 |
| 2004 | 1 | 2 |
| 2005 | 3 | 2 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 1 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and machine for sawing panels with laterally movable pusher10 Apr 2012US 8,151,677 B1Giben International S.P.A.
- Integrated circuit package separators7 Apr 2009US 7,513,182 B2Micron Technology, Inc.
- Integrated circuit package separators6 May 2008US 7,367,252 B2Micron Technology, Inc.
- Integrated circuit package separator methods2 Oct 2007US 7,276,397 B2Micron Technology, Inc.
- Sawing device for sheets of wood, plastic or the like18 Oct 2005US 6,955,108 B2GreCon Dimter Holzoptimierung Süd GmbH & Co. KG
- Integrated circuit package separators29 Dec 2005US 2005/0284274 A1Micron Technology, Inc.
- Integrated circuit package separators22 Dec 2005US 2005/0278944 A1Micron Technology, Inc.
- Integrated circuit package separators12 Aug 2004US 2004/0154451 A1Micron Technology, Inc.
- Integrated circuit package separator methods12 Aug 2004US 2004/0157411 A1Micron Technology, Inc.
- Sawing device for sheets of wood, plastic or the like31 Oct 2002US 2002/0157518 A1GreCon Dimter Holzoptimierung Süd GmbH & Co. KG
Most cited
By later US patents
- Methods of forming integrated circuit packages85US 6,277,671 B1Micron Technology, Inc. · 2001
- Apparatus and method for trimming a venetian blind assembly72US 4,819,530 ATeh Yor Industrial Co., Ltd. · 1989
- Production process of varying thickness osteosynthesis plates43US 6,315,852 B12001
- Rotary cutting apparatus27US 3,942,411 AGerber Garment Technology, Inc. · 1976
- Liquid jet cutting machine for cutting workpieces, especially flat workpieces24US 4,686,877 AVereinigte Edelstahlwerke Aktiengesellschaft (VEW) · 1987