Integrated circuit package separators

An integrated circuit package separator for separating a plurality of integrated circuit packages from one another, the integrated circuit packages being provided as integrated circuit chip components joined to a board, the separating including cutting the board, the separator comprising:

• a plurality of panels fastened to and a support with each panel elevationally above the support, each panel comprising a planar upper surface wherein each planar upper surface is positioned in a coplanar relationship to collectively establish a single and planar uppermost surface that extends as a single, continuous planar surface from one outer peripheral edge of the plane to all other outer peripheral edges of the plane of the planar uppermost surface which is devoid of inner peripheral edges and openings;
• a plurality of blocks extending upward and over the uppermost surface collectively established by the plurality of the panels, each block comprising an elongated structure extending parallel with each other block, the blocks having curved upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the curved upper surfaces and the panels;
• and
• a cutting mechanism configured to cut the board while the board is supported on the blocks and to thereby separate the integrated circuit packages from one another;
• and
• a pair of actuators, each actuator configured for driving a plate positioned beneath the support, the plates being moveable to vertically displace the support, each actuator comprising release values configured to equilibrate a back-pressure of the actuator to ambient prior to and during movement of the support.

An integrated circuit package separator for separating a plurality of integrated circuit packages from one another, the integrated circuit packages being provided as integrated circuit chip components joined to a board, the separating including cutting the board, the separator comprising:

• a panel fastened to a support, the panel comprising a pair of lengthwise edges connected by a pair of widthwise edges, the panel is removably secured to the support;
• a pair of blocks over and extending upwardly from the lengthwise edges of the panel, the blocks having curved upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the upper surfaces of the blocks and the panel;
• a cutting mechanism configured to cut the board while the board is supported on the blocks and to thereby separate the integrated circuit packages from one another;
• and
• a pair of actuators, each actuator configured for driving a plate positioned beneath the support, the plates being moveable to vertically displace the support, each actuator comprising release values configured to equilibrate a back-pressure of the actuator to ambient prior to and during movement of the support.