Integrated circuit package separator methods

An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits, comprising:

• providing a base having a plurality of pins extending upwardly therefrom;
• providing a support over the base, the support having a plurality of holes extending therethrough, the pins extending through the plurality of holes in the support and upwardly beyond an upper surface of the support;
• configuring the support and the base such that the plurality of pins extend into holes in the board when the board is placed over the upper surface of the support;
• vertically displacing the support off the pins using a pair of pneumatic actuators such that individual actuators of the pair lift respective opposing ends of the support substantially simultaneously and in unison;
• providing each actuator of the pair with release valves to equilibrate a back-pressure to ambient during lifting of the support;
• and
• separating the integrated circuit packages from one another when the board is over the upper surface of the support.