Y10S 451/91
Ultrasonic
Y10S451/91 (Ultrasonic) appears on 55 US grants and 26 published applications in this corpus.
Search patents in Y10S- Granted patents
- 55
- Published applications
- 26
- Assignees
- 36
- Inventors
- 91
- Latest grant
- 11 Mar 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 1 |
| 2002 | 7 | 0 |
| 2003 | 1 | 4 |
| 2004 | 4 | 3 |
| 2005 | 2 | 2 |
| 2006 | 2 | 1 |
| 2007 | 4 | 6 |
| 2008 | 3 | 5 |
| 2009 | 1 | 3 |
| 2010 | 6 | 0 |
| 2011 | 3 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for reducing pain during skin puncturing procedures11 Mar 2014US 8,668,664 B2Bing Innovations, LLC
- Device for surface blasting component10 Jan 2012US 8,091,192 B2MTU Aero Engines AG
- Apparatus and method for grinding workpiece26 Jul 2011US 7,985,120 B2Jtekt Corporation
- Apparatus and method for reducing pain during skin puncturing procedures19 Jul 2011US 7,981,071 B2Bing Innovations, LLC
- Apparatus for removing material from microfeature workpieces19 Apr 2011US 7,927,181 B2Micron Technology, Inc.
- Apparatus and method for reducing pain during skin puncturing procedures3 Nov 2011US 2011/0270154 A1Bing Innovations, LLC
- Superfinishing Stone and Superfinishing Process Using the Same5 Mar 2009US 2009/0061736 A1Jtekt Corporation
- Apparatus and method for grinding workpiece15 Jan 2009US 2009/0017734 A1Jtekt Corporation
- Apparatus and method for removing material from microfeature workpieces1 Jan 2009US 2009/0004951 A1Micron Technology, Inc.
- Vibrating Device25 Dec 2008US 2008/0318501 A1Honda Motor Co., Ltd.
Most cited
By later US patents
- Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media113US 6,083,085 AMicron Technology, Inc. · 2000
- Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media102US 6,350,691 B1Micron Technology, Inc. · 2002
- Apparatus for planarizing microelectronic substrates and conditioning planarizing media82US 6,354,923 B1Micron Technology, Inc. · 2002
- Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus62US 5,868,608 ALSI Logic Corporation · 1999
- Abrasive tool having safe and active areas59US 6,726,531 B12004