Y10S 165/048
Electrical component
Y10S165/048 (Electrical component) appears on 7 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 7
- Published applications
- 0
- Assignees
- 4
- Inventors
- 9
- Latest grant
- 3 Jul 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and apparatus for utilizing heat dissipated from an electrical device3 Jul 2001US 6,255,579 B1Motorola, Inc.
- Method and apparatus for utilizing heat dissipated from an electrical device9 Jan 2001US 6,172,448 B2Motorola, Inc.
- Heat transfer bag with thermal via19 Mar 1991US 5,000,256 AMinnesota Mining and Manufacturing Company
- Flexible membrane heat sink3 Jul 1990US 4,938,279 AHughes Aircraft Company
- Apparatus for cooling high-density integrated circuit packages26 Apr 1983US 4,381,032 A
No published applications in this class yet.
Most cited
By later US patents
- Fluid cooling systems for electronic systems132US 4,109,707 AHoneywell Information Systems Inc. · 1978
- Apparatus for cooling high-density integrated circuit packages111US 4,381,032 A1983
- Fluid cooling systems for electronic systems91US 4,072,188 AHoneywell Information Systems Inc. · 1978
- Heat transfer bag with thermal via72US 5,000,256 AMinnesota Mining and Manufacturing Company · 1991
- Flexible membrane heat sink60US 4,938,279 AHughes Aircraft Company · 1990