Heat transfer bag with thermal via
AssigneeMinnesota Mining and Manufacturing Company
InventorLew A. Tousignant
Life of this patent
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Abstract
A heat transfer bag especially useful for cooling electronic components is made of a flexible sheet of material and is filled with a fluorochemical heat transfer liquid. A metallic thermal via extends through a hole in the bag for direct contact with an external surface of a heat-generating component. A portion of the via extends into the bag and functions as a heat radiating fin to enhance the transfer of heat from the component to the liquid within the bag.
Claims11
Heat transfer apparatus adapted for placement between a surface of a component to be cooled and a surface of a heat-dissipating body, said apparatus comprising:
- a flexible, sealed bag made of a sheet of material impermeable to air and having an internal compartment, said sheet having a hole;
- a quantity of heat transfer liquid substantially filling said compartment;
- a thermal via extending through said hole in said sheet and having a high thermal conductivity, said via having a first portion extending externally of said bag for thermal contact with a surface of a heat-generating component and a second portion extending internally in said compartment for contact with said heat transfer liquid said second portion having a larger surface area than said first portion;
- and
- means for sealingly connecting said via to said sheet.
Dependencies are inferred from the claim text.