Apparatus for cooling high-density integrated circuit packages

An apparatus for cooling a high-density integrated circuit package of the type having a substrate with a plurality of discrete integrated circuits arranged thereon in a predetermined geometric array, said apparatus comprising:

• (a) a housing defining an open coolant chamber which is sized so that its opening substantially matches the surface area of the substrate of the integrated circuit package, said housing for positioning in overlaying relationship with respect to the integrated circuit package;
• (b) a diaphragm of thin-wall pliable heat conductive material with its peripheral edges fixedly attached to said housing so as to sealingly enclose the coolant chamber thereof, said diaphragm being in contiguous engagement with each of the discrete integrated circuits of the integrated circuit package when said housing is in overlaying relationship therewith;
• (c) said housing having an inlet port and an outlet port by which fluid coolant is passable through the coolant chamber of said housing;
• (d) partition means fixed in the coolant chamber of said housing for presenting a tortuous flow path for the fluid coolant which is passable therethrough;
• and
• (e) biasing means mounted on said partition means within the coolant chamber of said housing for applying biasing forces on said diaphragm at each location thereof which is in contiguous engagement with the discrete integrated circuits of the integrated circuit package when said housing is in overlaying relationship therewith.