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  1. Technology classes
  2. /Y · General tagging of new technological developments
  3. /Y10 · Technical subjects covered by former uspc
  4. /Y10S · Technical subjects covered by former uspc cross-reference art collections [xracs] and digests
  5. /Y10S 148/00 · Metal treatment
  6. /Y10S 148/007
Y10S 148/007

Autodoping

Y10S148/007 (Autodoping) appears on 26 US grants and 0 published applications in this corpus.

Search patents in Y10S

Where it sits

  1. YGeneral tagging of new technological developments
  2. Y10Technical subjects covered by former uspc
  3. Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests
  4. Y10S 148/00Metal treatment
  5. Y10S 148/007Autodoping
Granted patents
26
Published applications
0
Assignees
16
Inventors
51
Latest grant
18 Nov 1997

Filings by year

Granted patentsPublished applications
Y10S 148/007: granted patents and published applications per publication year
YearGranted patentsPublished applications
1976100
197700
197830
197900
198000
198100
198200
198300
198400
198510
198610
198730
198800
198920
199010
199110
199200
199300
199400
199510
199610
199720

197619861997

By publication year. Applications have been published since 2001.

Recent patents

  • Method of fabricating a twin - well CMOS device18 Nov 1997US 5,688,710 AHoltek Microelectronics, Inc.
  • Bifacial solar cell9 Sep 1997US 5,665,175 A
  • Method for reducing dopant diffusion11 Jun 1996US 5,525,529 ATexas Instruments Incorporated
  • Method of making diffused doped areas for semiconductor components24 Oct 1995US 5,461,002 A
  • Method for manufacturing a heterostructure transistor having a germanium layer on gallium arsenide using molecular beam epitaxial growth10 Sep 1991US 5,047,365 ANEC Corporation

No published applications in this class yet.

Most cited

By later US patents
  • Bifacial solar cell151US 5,665,175 A1997
  • Method of making diffused doped areas for semiconductor components53US 5,461,002 A1995
  • Accurate control during vapor phase epitaxy32US 3,930,908 ARCA Corporation · 1976
  • Back sealing of silicon wafers22US 4,687,682 AAmerican Telephone and Telegraph Company, AT&T Technologies, Inc. · 1987
  • Method for reducing dopant diffusion20US 5,525,529 ATexas Instruments Incorporated · 1996

Top assignees

Documents
  • BTBell Telephone Laboratories, Incorporated3
  • Texas Instruments Incorporated3
  • International Business Machines Corporation2
  • Kabushiki Kaisha Toshiba2
  • RCA Corporation2
  • ATAmerican Telephone and Telegraph Company, AT&T Technologies, Inc.1
  • GEGeneral Electric Company1
  • HMHoltek Microelectronics, Inc.1
  • IBM Corporation1
  • MHMetallurgie Hoboken-Overpelt1

Often classified with

  • H10PGeneric processes or apparatus for the manufacture or treatment of devices covered21
  • H10DInorganic electric semiconductor devices8
  • H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by6
  • C30BSingle-crystal growth3
  • H10HInorganic light-emitting semiconductor devices having potential barriers3
  • H10FSolar cells and light sensors2
  • Y02EClean energy generation and storage2
  • Y02PLow-carbon manufacturing2
  • H01SDevices using the process of light amplification by stimulated emission of radiation1

Documents that also carry the other class.

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