H10H 29/942
Serial electrical configurations of multiple light-emitting semiconductor components or devices
Official title: {Serial electrical configurations of multiple light-emitting semiconductor components or devices}
H10H29/942 (Serial electrical configurations of multiple light-emitting semiconductor components or devices) appears on 30 US grants and 115 published applications in this corpus.
Search patents in H10H- Granted patents
- 30
- Published applications
- 115
- Assignees
- 60
- Inventors
- 324
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 3 |
| 2014 | 3 | 1 |
| 2015 | 3 | 4 |
| 2016 | 2 | 1 |
| 2017 | 3 | 3 |
| 2018 | 2 | 3 |
| 2019 | 0 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 1 |
| 2022 | 2 | 3 |
| 2023 | 1 | 4 |
| 2024 | 2 | 7 |
| 2025 | 5 | 54 |
| 2026 | 2 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- LED filament and LED light bulb2 Jun 2026US 12,644,570 B2Zhejiang Super Lighting Electric Appliance Co., Ltd
- Backplane and glass-based circuit board13 Jan 2026US 12,525,568 B2Beijing Boe Display Technology Co., Ltd.
- Optoelectronic device manufacturing method30 Dec 2025US 12,514,048 B2Aledia
- Splicing display device12 Aug 2025US 12,386,218 B2Tcl China Star Optoelectronics Technology Co., Ltd.
- LED filament and LED light bulb15 Jul 2025US 12,359,779 B1Zhejiang Super Lighting Electric Appliance Co., Ltd
- Substrate for illumination device with heat dissipation wiring10 Sep 2026US 2026/0264607 A1Toyoda Gosei Co., Ltd.
- Light-emitting diode and display module including same27 Aug 2026US 2026/0255734 A1Samsung Electronics Co., Ltd.
- Die metallization for dense packed arrays23 Jul 2026US 2026/0215047 A1Lumileds LLC
- Submount structures of light-emitting diodes and related methods9 Jul 2026US 2026/0198160 A1CreeLED, Inc.
- Light-emitting backplane and display apparatus9 Jul 2026US 2026/0198164 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Apparatus for providing radiant energy203US 5,278,432 AQuantam Devices, Inc. · 1994
- Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays18US 8,809,880 B2Cree, Inc. · 2014
- Multi-chip LED devices12US 8,696,159 B2Cree, Inc. · 2014
- Semiconductor element string structure5US 4,979,017 A1990
- Bonding LED die to lead frame strips5US 9,530,949 B2Koninklijke Philips N. V. · 2016