Submount structures of light-emitting diodes and related methods

A method for forming a light-emitting diode (LED) package, the method comprising:

• providing a submount comprising a first surface, a second surface, and a perimeter sidewall extending between the first surface and the second surface;
• forming a chip bonding pad on the first surface and a package bonding pad on the second surface;
• depositing a sidewall connector on the perimeter sidewall, the sidewall connector electrically coupling the chip bonding pad to the package bonding pad along the perimeter sidewall;
• and
• attaching an LED chip to the chip bonding pad, the LED chip covering at least 80% of an area of the first surface.

A light-emitting diode (LED) package, comprising:

• a submount comprising a first surface, a second surface, and a perimeter sidewall extending between the first surface and the second surface;
• a chip bonding pad on the first surface;
• an LED chip mounted to the chip bonding pad;
• a package bonding pad on the second surface;
• and
• a sidewall connector electrically coupling the chip bonding pad to the package bonding pad along the perimeter sidewall, the sidewall connector forming at least one half via along the perimeter sidewall.