Bonding LED die to lead frame strips

A light emitting structure comprising:

• a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip;
• a plurality of first light emitting diode (LED) dies, each of the first LED dies having a first electrode and a second electrode, wherein the first electrode of the first LED dies is electrically and thermally coupled to a top surface of the first strip;
• a plurality of second LED dies, each of the second LED dies having a third electrode and a fourth electrode, wherein the third electrode of the second LED dies is electrically and thermally coupled to a top surface of the second strip;
• the second electrode of the first LED dies being wire bonded to the second strip, and the fourth electrode of the second LED dies being wire bonded to the third strip, to cause the first LED dies to be connected in series with the second LED dies;
• and
• a single-piece, first optically transmissive enclosure molded over a first set of the first LED dies and over a second set of the second LED dies, the first optically transmissive enclosure also being molded around the plurality of lead frame strips to mechanically connect the lead frame strips together;
• a single-piece, second optically transmissive enclosure molded over a third set of the first LED dies and over a fourth set of the second LED dies, the second optically transmissive enclosure also being molded around the plurality of lead frame strips to mechanically connect the lead frame strips together,
• where there is a gap between the first optically transmissive enclosure and the second optically transmissive enclosure to allow bending of the lead frame strips within the gap,
• at least one of the first strip, the second strip and the third strip being configured to be electrically coupled to a power source to supply a current through the first LED dies and the second LED dies;
• a housing of a module enclosing the first LED dies, the second LED dies, the first and second optically transmissive enclosures and the metal lead frame strips,
• wherein the plurality of lead frame strips are secured together by at least the first optically transmissive enclosure and the second optically transmissive enclosure and bent in a permanent configuration at the gap between the first optically transmissive enclosure and the second optically transmissive enclosure, such that an arrangement of LEDs is fixed within the housing, to form the module having a predetermined light emission profile determined by the fixed arrangement of LEDs in the module.