H10F 39/90
Assemblies of multiple devices
H10F39/90 (Assemblies of multiple devices) appears on 4 US grants and 86 published applications in this corpus.
Search patents in H10F- Granted patents
- 4
- Published applications
- 86
- Assignees
- 52
- Inventors
- 230
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 2 |
| 2024 | 1 | 4 |
| 2025 | 1 | 26 |
| 2026 | 1 | 51 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device30 Sep 2025US 12,433,084 B2LG Electronics Inc.
- Semiconductor package and manufacturing method of semiconductor package8 Oct 2024US 12,113,022 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor packages and related methods4 Oct 2022US 11,462,580 B2Semiconductor Components Industries, LLC
- Optical multi-chip interconnect bridge architecture and fabrication processes8 Oct 2026US 2026/0314433 A1Sicily Merger Sub II, Inc.
- Radiographic imaging device1 Oct 2026US 2026/0299147 A1Hamamatsu Photonics K.K.
- Detection apparatus and driving method therefor1 Oct 2026US 2026/0304991 A1Beijing Boe Optoelectronics Technology Co., Ltd.
- Package structure1 Oct 2026US 2026/0304995 A1Ennostar Corporation
- Optoelectronic device1 Oct 2026US 2026/0305031 A1ams-OSRAM AG
Most cited
By later US patents