H05K 7/12
Resilient or clamping means for holding component to structure
H05K7/12 (Resilient or clamping means for holding component to structure) appears on 411 US grants and 301 published applications in this corpus.
Search patents in H05K- Granted patents
- 411
- Published applications
- 301
- Assignees
- 284
- Inventors
- 859
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 9 | 0 |
| 1979 | 2 | 0 |
| 1980 | 9 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 13 | 0 |
| 1987 | 11 | 0 |
| 1988 | 8 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 3 |
| 2002 | 4 | 3 |
| 2003 | 4 | 5 |
| 2004 | 3 | 9 |
| 2005 | 7 | 6 |
| 2006 | 4 | 5 |
| 2007 | 4 | 4 |
| 2008 | 1 | 8 |
| 2009 | 8 | 6 |
| 2010 | 5 | 4 |
| 2011 | 3 | 5 |
| 2012 | 6 | 8 |
| 2013 | 6 | 24 |
| 2014 | 6 | 21 |
| 2015 | 18 | 22 |
| 2016 | 15 | 12 |
| 2017 | 13 | 15 |
| 2018 | 17 | 14 |
| 2019 | 28 | 28 |
| 2020 | 25 | 19 |
| 2021 | 16 | 15 |
| 2022 | 17 | 20 |
| 2023 | 9 | 18 |
| 2024 | 19 | 13 |
| 2025 | 12 | 8 |
| 2026 | 9 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical junction box25 Aug 2026US 12,719,252 B2Autonetworks Technologies, Ltd.
- Electronic device and cable clip thereof18 Aug 2026US 12,713,549 B2Wiwynn Corporation
- Lock mechanism and power supply device28 Jul 2026US 12,696,410 B2Murata Manufacturing Co., Ltd.
- Electronic control unit having positioning member for positioning base substrate and electronic device21 Jul 2026US 12,690,144 B2Denso Corporation
- Fixed structure and electronic apparatus14 Jul 2026US 12,684,723 B2Getac Technology Corporation
- Testing device and its adapter holder30 Jul 2026US 2026/0219298 A1Chroma Ate Inc.
- Electronic component, terminal structure for electronic component, and electronic device2 Jul 2026US 2026/0188926 A1Tokyo Cosmos Electric Co., Ltd.
- Display apparatus18 Jun 2026US 2026/0173293 A1Samsung Electronics Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Integrated component, motor controller, and powertrain26 Feb 2026US 2026/0054577 A1Huawei Digital Power Technologies Co., Ltd.
Most cited
By later US patents
- Junction box for solar modules295US 4,460,232 AAMP Incorporated · 1984
- Process of forming a compliant lead frame for array-type semiconductor packages129US 4,751,199 AFairchild Semiconductor Corporation · 1988
- LGA socket115US 7,101,210 B2Hon Hai Precision Ind.Co., Ltd. · 2006
- Colorimetric assay by enzymatic oxidation in the presence of an aromatic nitroso or oxime compound104US 5,206,147 ABoehringer Mannheim GmbH · 1993
- Fixing component92US 4,681,288 AShinagawa Shoko Co., Ltd. · 1987