H05K 5/065
Sealed by encapsulation
Official title: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding}
H05K5/065 (Sealed by encapsulation) appears on 265 US grants and 310 published applications in this corpus.
Search patents in H05K- Granted patents
- 265
- Published applications
- 310
- Assignees
- 195
- Inventors
- 734
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 3 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 7 |
| 2006 | 2 | 8 |
| 2007 | 6 | 2 |
| 2008 | 2 | 7 |
| 2009 | 5 | 9 |
| 2010 | 4 | 7 |
| 2011 | 1 | 3 |
| 2012 | 7 | 5 |
| 2013 | 5 | 7 |
| 2014 | 2 | 14 |
| 2015 | 7 | 24 |
| 2016 | 11 | 11 |
| 2017 | 17 | 15 |
| 2018 | 14 | 40 |
| 2019 | 25 | 35 |
| 2020 | 36 | 35 |
| 2021 | 37 | 24 |
| 2022 | 21 | 10 |
| 2023 | 18 | 13 |
| 2024 | 10 | 18 |
| 2025 | 10 | 7 |
| 2026 | 8 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Data pod release system18 Aug 2026US 12,709,368 B2The United States of America as represented by the Secretary of the Navy
- FPC mounting module, electronic device, and mounting method11 Aug 2026US 12,707,582 B2Huawei Technologies Co., Ltd.
- Customizable vacuum test systems and methods16 Jun 2026US 12,656,207 B2Blue Origin Manufacturing, LLC
- Zettascale supercomputer12 May 2026US 12,628,317 B2
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Smart glasses with overmolded portions for flexible printed circuit sealing through hinges, and systems and methods of use thereof2 Jul 2026US 2026/0186309 A1Meta Platforms Technologies, LLC
- Electronic Device with Three-dimensionally Non-planar Mold Body having Electric Entity therein and Electrically Conductive Structure thereon30 Apr 2026US 2026/0123518 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Overmolded grommet for flexible printed circuit sealing through hinges in wearable devices, and systems and methods of use thereof26 Feb 2026US 2026/0056418 A1Meta Platforms Technologies, LLC
- Voltage regulator module11 Sep 2025US 2025/0286457 A1Delta Electronics, Inc.
- Electronic component unit and manufacturing method thereof17 Jul 2025US 2025/0234471 A1Honda Motor Co., Ltd.
Most cited
By later US patents
- Semiconductor card and method of fabrication116US 6,462,273 B1Micron Technology, Inc. · 2002
- Method of forming an electrical contact96US 8,966,747 B2VLT, Inc. · 2015
- Waterproof box structure51US 9,301,414 B2Getac Technology Corporation · 2016
- Method of producing an overmolded electronic module with a flexible circuit pigtail49US 7,739,791 B2Delphi Technologies, Inc. · 2010
- Method for forming an electronic assembly39US 6,807,731 B2Delphi Technologies, Inc. · 2004