Overmolded grommet for flexible printed circuit sealing through hinges in wearable devices, and systems and methods of use thereof

Abstract

An extended-reality headset is disclosed herein. The extended-reality headset including a frame portion including one or more electrical components, a temple arm including one or more additional electrical components. The frame portion is coupled, via a hinge, to the temple arm. The extended-reality headset further includes a flexible printed circuit configured to couple at least one of the one or more additional electrical components of the temple arm with at least one of the one or more electrical components of the frame. The flexible printed circuit (FPC) incudes (i) an overmolded temple grommet configured to seal the one or more additional electrical components of the temple arm, and (ii) an overmolded frame grommet configured to seal the one or more electrical components of the frame. The FPC is further configured to move with the movement of the temple arm relative to the frame portion.

Dependencies are inferred from the claim text.