H05K 5/003
Having an integrally preformed housing
Official title: {having an integrally preformed housing}
H05K5/003 (Having an integrally preformed housing) appears on 53 US grants and 55 published applications in this corpus.
Search patents in H05K- Granted patents
- 53
- Published applications
- 55
- Assignees
- 48
- Inventors
- 154
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 2 | 2 |
| 2015 | 1 | 8 |
| 2016 | 1 | 2 |
| 2017 | 8 | 2 |
| 2018 | 2 | 4 |
| 2019 | 7 | 4 |
| 2020 | 3 | 1 |
| 2021 | 2 | 6 |
| 2022 | 3 | 3 |
| 2023 | 5 | 6 |
| 2024 | 4 | 11 |
| 2025 | 6 | 2 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Housing element with two-part electrical contact for an electronic circuit28 Jul 2026US 12,696,401 B2TE Connectivity Solutions GmbH
- Remote driver control center2 Jun 2026US 12,648,089 B2Infinilux, Inc.
- Printed circuit board assembly for an aircraft solid state power controller17 Mar 2026US 12,581,594 B2Hs Elektronik Systeme GmbH
- Arrangement of two secondary circuit boards within an electronic device18 Nov 2025US 12,477,666 B2Honor Device Co., Ltd.
- Cooling conduit for electrical components on a PCB30 Sep 2025US 12,432,844 B2BorgWarner Inc.
- Remote driver control center13 Aug 2026US 2026/0239544 A1Infinilux, Inc.
- Connector assembly and vehicle electronic control unit including same5 Feb 2026US 2026/0040467 A1Hl Mando Corporation
- Electronic device18 Sep 2025US 2025/0294670 A1Advanced Semiconductor Engineering, Inc.
- Housing for a circuit board and electric circuit arrangement13 Feb 2025US 2025/0056737 A1Lisa Dräxlmaier GmbH
- Electronic device including supporting structure for printed circuit board19 Dec 2024US 2024/0422911 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Laminated electronic module assembly131US 5,179,501 AMotorola, Inc. · 1993
- Flexible circuit board assembly and method70US 5,434,362 AMotorola, Inc. · 1995
- Electronic module assembly and method of forming same39US 5,265,322 AMotorola, Inc. · 1993
- Hand held appliance28US 10,085,538 B2Dyson Technology Limited · 2018
- Electronic module assembly and method of forming same25US 5,216,581 AMotorola, Inc. · 1993