H04N 25/79
Arrangements of circuitry being divided between different or multiple substrates, chips or
Official title: Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
H04N25/79 (Arrangements of circuitry being divided between different or multiple substrates, chips or) appears on 1,454 US grants and 1,859 published applications in this corpus.
Search patents in H04N- Granted patents
- 1,454
- Published applications
- 1,859
- Assignees
- 233
- Inventors
- 1,912
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 2 |
| 2003 | 0 | 6 |
| 2004 | 3 | 1 |
| 2005 | 1 | 2 |
| 2006 | 2 | 2 |
| 2007 | 2 | 4 |
| 2008 | 1 | 13 |
| 2009 | 4 | 5 |
| 2010 | 5 | 8 |
| 2011 | 6 | 8 |
| 2012 | 8 | 15 |
| 2013 | 9 | 39 |
| 2014 | 23 | 29 |
| 2015 | 44 | 42 |
| 2016 | 37 | 51 |
| 2017 | 55 | 66 |
| 2018 | 63 | 84 |
| 2019 | 64 | 143 |
| 2020 | 140 | 193 |
| 2021 | 135 | 192 |
| 2022 | 150 | 216 |
| 2023 | 176 | 226 |
| 2024 | 230 | 230 |
| 2025 | 184 | 174 |
| 2026 | 103 | 108 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hybrid imaging sensor with shared readout6 Oct 2026US 12,756,954 B2OmniVision Technologies, Inc.
- Image sensor with in-pixel background subtraction and motion detection29 Sep 2026US 12,747,338 B2OmniVision Technologies, Inc.
- Image sensor system, a camera module, an electronic device and a method for operating a camera module for detecting events using infrared29 Sep 2026US 12,750,570 B2Telefonaktiebolaget LM Ericsson (publ)
- Photoelectric conversion apparatus, photoelectric conversion system, and moving object29 Sep 2026US 12,750,601 B2Canon Kabushiki Kaisha
- Power delivery scheme to enhance image quality29 Sep 2026US 12,750,602 B1Apple Inc.
- Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array1 Oct 2026US 2026/0301205 A1Adeia Imaging LLC
- Row driver assembly and solid-state imaging device1 Oct 2026US 2026/0303992 A1Sony Semiconductor Solutions Corporation
- Image sensor module, camera module, and manufacturing method thereof1 Oct 2026US 2026/0304010 A1LG Innotek Co., Ltd.
- Imaging systems with dynamic image sensor configuration adjustment24 Sep 2026US 2026/0292335 A1OmniVision Technologies, Inc.
- Photoelectric conversion device24 Sep 2026US 2026/0292364 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Vertically stacked image sensor284US 8,773,562 B1Apple Inc. · 2014
- Digital camera with integrated infrared (IR) response277US 7,566,855 B22009
- Solid-state image sensor with focal-plane digital photon-counting pixel array228US 5,665,959 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Adminstration · 1997
- Capturing and processing of images using monolithic camera array with heterogeneous imagers215US 8,866,920 B2Pelican Imaging Corporation · 2014
- Capturing and processing of images including occlusions focused on an image sensor by a lens stack array134US 9,188,765 B2Pelican Imaging Corporation · 2015