H03K 99/00
Subject matter not provided for in other groups of this subclass
H03K99/00 (Subject matter not provided for in other groups of this subclass) appears on 11 US grants and 12 published applications in this corpus.
Search patents in H03K- Granted patents
- 11
- Published applications
- 12
- Assignees
- 7
- Inventors
- 15
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 1 | 3 |
| 2014 | 0 | 1 |
| 2015 | 2 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device having stacked chips5 Aug 2025US 12,381,183 B2Kioxia Corporation
- Semiconductor device having stacked chips20 Apr 2021US 10,985,141 B2Toshiba Memory Corporation
- Semiconductor device having stacked chips21 Jan 2020US 10,541,231 B2Toshiba Memory Corporation
- Semiconductor device having stacked chips18 Dec 2018US 10,157,894 B2Toshiba Memory Corporation
- Facilitating dynamic pipelining of workload executions on graphics processing units on computing devices4 Sep 2018US 10,068,306 B2Intel Corporation
- Semiconductor device having stacked chips8 Jan 2026US 2026/0011692 A1Kioxia Corporation
- Semiconductor device having stacked chips8 Jul 2021US 2021/0210467 A1Toshiba Memory Corporation
- Semiconductor device having stacked chips7 May 2020US 2020/0144225 A1Toshiba Memory Corporation
- Semiconductor device having stacked chips28 Mar 2019US 2019/0096854 A1Toshiba Memory Corporation
- Semiconductor device having stacked chips15 Mar 2018US 2018/0076180 A1Toshiba Memory Corporation
Most cited
By later US patents
- Semiconductor device having stacked chips8US 8,928,399 B2Kabushiki Kaisha Toshiba · 2015
- Semiconductor device having stacked chips5US 9,431,322 B2Kabushiki Kaisha Toshiba · 2016
- Facilitating dynamic pipelining of workload executions on graphics processing units on computing devices4US 10,068,306 B2Intel Corporation · 2018
- Semiconductor device having stacked chips4US 10,157,894 B2Toshiba Memory Corporation · 2018
- Semiconductor device having stacked chips4US 9,853,013 B2Toshiba Memory Corporation · 2017