H01H 85/006
Heat reflective or insulating layer on the casing or on the fuse
Official title: {Heat reflective or insulating layer on the casing or on the fuse support}
H01H85/006 (Heat reflective or insulating layer on the casing or on the fuse) appears on 13 US grants and 14 published applications in this corpus.
Search patents in H01H- Granted patents
- 13
- Published applications
- 14
- Assignees
- 12
- Inventors
- 37
- Latest grant
- 14 Jun 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 2 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 2 | 1 |
| 2020 | 1 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Protective element and a fabrication method thereof14 Jun 2022US 11,362,505 B2Conquer Electronics Co., Ltd.
- Fuse with integrated heat shield10 Aug 2021US 11,087,945 B1Littelfuse, Inc.
- Fuse device28 Jul 2020US 10,727,019 B2Dexerials Corporation
- Fuse element, fuse device, and protective device10 Sep 2019US 10,410,818 B2Dexerials Corporation
- Fuse in chip design16 Jul 2019US 10,354,826 B2VISHAY BCcomponents BEYSCHLAG GmbH
- Liquid ingress protection and design of electronic circuitry for negative pressure wound therapy systems29 Aug 2024US 2024/0285847 A1T.J. Smith and Nephew, Limited
- Protective element and a fabrication method thereof14 Apr 2022US 2022/0115860 A1Conquer Electronics Co., Ltd.
- Fuse element, fuse device, and protective device6 Jun 2019US 2019/0172673 A1Dexerials Corporation
- Fuse device11 Oct 2018US 2018/0294125 A1Dexerials Corporation
- Fuse in chip design22 Dec 2016US 2016/0372293 A1VISHAY BCcomponents BEYSCHLAG GmbH
Most cited
By later US patents
- Low amperage microfuse41US 5,097,246 ACooper Industries, Inc. · 1992
- Low resistance polymer matrix fuse apparatus and method14US 7,385,475 B2Cooper Technologies Company · 2008
- Fuse unit10US 9,425,018 B2Yazaki Corporation · 2016
- Low resistance polymer matrix fuse apparatus and method6US 7,570,148 B2Cooper Technologies Company · 2009
- Electrical fuselinks5US 4,757,296 ADubilier PLC · 1988