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US 2018/0294125 A1Published application
Fuse device
AssigneeDexerials Corporation
InventorsYoshihiro YONEDA, Yuji FURUUCHI
Life of this patent
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Abstract
A fuse device includes a fuse element and a cooling member, wherein the fuse element includes a low thermal conductivity portion having a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion having a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.
Claims56
A fuse device comprising:
- a fuse element;
- and
- a cooling member,
- wherein the fuse element includes a low thermal conductivity portion provided with a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion provided with a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.
1 more element
Dependencies are inferred from the claim text.