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US 10,727,019 B2Granted
Fuse device
AssigneeDexerials Corporation
InventorsYoshihiro Yoneda, Yuji Furuuchi
Life of this patent
Estimating the term…
Abstract
A fuse device includes a fuse element and a cooling member, wherein the fuse element includes a low thermal conductivity portion having a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion having a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.
Claims55
A fuse device comprising:
- a fuse element;
- and
- a cooling member,
- wherein the fuse element includes a low thermal conductivity portion provided with a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion provided with a relatively high thermal conductivity, the high thermal conductivity portion being in contact with or close to the cooling member at a portion other than the interrupting portion,
- wherein the fuse element is a plate-shaped, and
- wherein the length of the low thermal conductivity portion in a current direction of the fuse element is equal to or less than a minimum width of the fuse element at the interrupting portion.
3 more elements
Dependencies are inferred from the claim text.