H01H 2227/014
Conductive particles
H01H2227/014 (Conductive particles) appears on 20 US grants and 5 published applications in this corpus.
Search patents in H01H- Granted patents
- 20
- Published applications
- 5
- Assignees
- 11
- Inventors
- 22
- Latest grant
- 13 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Low cost three-dimensional stacking semiconductor assemblies13 Aug 2024US 12,062,607 B2Micron Technology, Inc.
- Low cost three-dimensional stacking semiconductor assemblies4 Oct 2022US 11,462,472 B2Micron Technology, Inc.
- Pressure sensitive conductive sheet and panel switch using same5 May 2009US 7,528,337 B2Panasonic Corporation
- Compact electronic device31 Jan 1989US 4,801,768 ACasio Computer Co., Ltd.
- Compact electronic device14 Jul 1987US 4,680,432 ACasio Computer Co., Ltd.
- Low cost three-dimensional stacking semiconductor assemblies7 Nov 2024US 2024/0371755 A1Micron Technology, Inc.
- Low cost three-dimensional stacking semiconductor assemblies26 Jan 2023US 2023/0025886 A1Micron Technology, Inc.
- Low cost three-dimensional stacking semiconductor assemblies10 Feb 2022US 2022/0044998 A1Micron Technology, Inc.
- Multicontact touch-sensitive sensor including variable-size and variable-impedance spacing means16 Jun 2011US 2011/0141026 A1Stantum
- Pressure sensitive conductive sheet and panel switch using same20 Nov 2008US 2008/0283380 A1Matsushita Electric Industrial Co., Ltd.
Most cited
By later US patents