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US 4,680,432 AGranted
Compact electronic device
AssigneeCasio Computer Co., Ltd.
InventorsKazuhiro Sugiyama, Yoshio Kawai
Life of this patent
Estimating the term…
Abstract
A key switch structure comprises a first insulating cover having on one surface thereof a first conductive layer and an anisotropically electrical conductive layer printed on the first conductive layer, a second insulating cover having one surface arranged at a side opposite to the anisotropically electrical conductive layer on the first cover member, and a second conductive layer sandwiched between the anisotropically electrical conductive layer and the second insulating cover. At least, one of the first and second insulating covers being flexible. A depression force is selectively introduced from the other surface side of the flexible cover through the anisotropically electrical conductive layer so as to form a conductive path between the first and second conductive layers.
Claims42
A method for fabricating a key switch comprising the steps of:
- forming a first conductive layer on a first surface;
- forming connecting terminals on said first surface;
- forming a first conductive pattern on said first surface for connecting said first conductive layer with some electrodes of an electronic component and for connecting other electrodes of the electronic component with said connecting terminals;
- forming an insulating layer covering said first conductive pattern but leaving the connecting terminals and the first conductive layer exposed;
- forming a plurality of anisotropically electrical conductive islands on said first conductive layer;
- forming a second conductive layer on said islands;
- and
- forming a second conductive pattern on a side of said insulating layer opposite from the first conductive pattern for connecting said second conductive layer to said connecting terminals.
5 more elements
A compact electronic device, comprising:
- a first cover having an outer surface, said first cover being flexible;
- a second cover having an outer surface, said second cover being rigid and having cavities for respectively receiving integrated circuit chip and display panel arrangement sections;
- a plurality of anisotropically electrical conductive islands arranged on a support surface between said outer surfaces, respectively, of the first and second covers, each of said islands having two opposed ends facing, respectively, said first and second covers;
- a first conductive layer contacting one end of said islands and positioned between said islands and one of said first and second covers;
- a second conductive layer contacting the other end of said islands and positioned between said islands and the other of said first and second covers;
- connecting terminals arranged on the peripheries of said cavities for said integrated circuit chip and display panel arrangement sections;
- conductive pattern means formed on said support surface for connecting at least one of said first and second conductive layers with said connecting terminals;
- an insulating layer covering said conductive pattern while leaving said connecting terminals exposed;
- an integrated circuit chip which is arranged in the respective cavity for receiving said integrated circuit chip arrangement section, said integrated circuit chip having electrodes which are connected to some of said connecting terminals;
- and
- a display panel which is arranged in the respective cavity for receiving said display panel arrangement section, said display panel having electrodes which are connected to other of said connecting terminals.
8 more elements
A compact electronic device, comprising:
- a first cover having an outer surface, said first cover being flexible;
- a second cover having an outer surface, said second cover being rigid;
- a plurality of anisotropically electrical conductive islands arranged on a support surface between said outer surfaces, respectively, of the first and second covers, each of said islands having two opposed ends facing, respectively, said first and second covers;
- a plurality of first conductive patterns each of which has a number of key input terminals contacting one end of said islands, a pattern connecting terminal, and a chip connecting terminal;
- a plurality of second conductive patterns each of which has a number of key input terminals contacting the other end of said islands and a chip connecting terminal, and being connected to said pattern connecting terminal;
- an integrated circuit chip carried on said second cover, said integrated circuit chip having electrodes which are connected to the chip connecting terminals;
- and
- an insulating layer for covering at least said first conductive patterns while leaving said second conductive patterns and chip connecting terminals exposed.
5 more elements
The compact electronic device comprising:
- a substrate, said substrate being substantially rigid;
- a plurality of first key input terminals formed on said substrate;
- a plurality of anisotropically electrical conductive islands printed on each of said first key input terminals;
- conductive pattern means formed on said substrate, including a plurality of connecting terminals connected to said islands;
- a first insulating layer for covering said conductive pattern means while leaving said connecting terminals exposed, said first insulating layer having substantially the same outer surface as said islands;
- a plurality of second key input terminals connected to the outer surface of each of said islands;
- an integrated circuit chip which is carried on said substrate and having electrodes which are connected to said connecting terminals;
- and
- a second insulating layer for covering said first insulating layer, said second key input terminals and said integrated circuit chip.
6 more elements
Dependencies are inferred from the claim text.