H01G 2/14
Protection against electric or thermal overload
Official title: Protection against electric or thermal overload (by cooling H01G2/08)
H01G2/14 (Protection against electric or thermal overload) appears on 259 US grants and 217 published applications in this corpus.
Search patents in H01G- Granted patents
- 259
- Published applications
- 217
- Assignees
- 149
- Inventors
- 540
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 8 | 0 |
| 1988 | 9 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 0 |
| 2003 | 5 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 3 |
| 2006 | 4 | 5 |
| 2007 | 6 | 13 |
| 2008 | 3 | 7 |
| 2009 | 8 | 5 |
| 2010 | 5 | 5 |
| 2011 | 6 | 6 |
| 2012 | 4 | 1 |
| 2013 | 3 | 9 |
| 2014 | 9 | 12 |
| 2015 | 4 | 14 |
| 2016 | 11 | 11 |
| 2017 | 14 | 19 |
| 2018 | 16 | 15 |
| 2019 | 19 | 13 |
| 2020 | 8 | 15 |
| 2021 | 15 | 9 |
| 2022 | 8 | 8 |
| 2023 | 8 | 13 |
| 2024 | 10 | 10 |
| 2025 | 9 | 12 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Capacitor module6 Oct 2026US 12,755,900 B2Murata Manufacturing Co., Ltd.
- Multilayer electronic component16 Jun 2026US 12,658,365 B2Samsung Electro-Mechanics Co., Ltd.
- Stacked ceramic capacitor package for electronic device31 Mar 2026US 12,592,344 B2Amotech Co., Ltd.
- Capacitor with multiple elements for multiple replacement applications17 Mar 2026US 12,580,132 B2HVAC South, LLC
- Solid electrolytic capacitor having a sealing vent structure17 Mar 2026US 12,580,136 B2Murata Manufucturing Co., Ltd.
- Multilayer ceramic electronic component3 Sep 2026US 2026/0260808 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor23 Jul 2026US 2026/0213069 A1Taiyo Yuden Co., Ltd.
- Multilayer electronic component2 Jul 2026US 2026/0188574 A1Samsung Electro-Mechanics Co., Ltd.
- Energy storage module and an energy storage system for a power grid11 Jun 2026US 2026/0162891 A1Hitachi Energy Ltd
- Multilayer Component, Multilayer Component Assembly, and Methods for Forming a Multilayer Component7 May 2026US 2026/0128215 A1KYOCERA AVX Components Corporation
Most cited
By later US patents
- Leak-tight and rupture proof, ultrasonically-welded, polymer-encased electrical capacitor with pressure sensitive circuit interrupter121US 5,381,301 AAerovox Incorporated · 1995
- Pressure sensitive interrupter114US 4,106,068 AGeneral Electric Company · 1978
- Polymer-encased electrical capacitor with pressure sensitive circuit interrupter110US 5,148,347 AAerovox Incorporated · 1992
- Capacitor for multiple replacement applications107US 7,203,053 B2American Radionic Company, Inc. · 2007
- Capacitor circuit interruption105US 5,019,934 AAerovox Incorporated · 1991