Stacked ceramic capacitor package for electronic device

A stacked ceramic capacitor package, comprising:

• a stacked ceramic capacitor;
• a first terminal structure connected to a first side surface of the stacked ceramic capacitor;
• and
• a second terminal structure connected to a second side surface of the stacked ceramic capacitor and disposed to face the first terminal structure with the stacked ceramic capacitor therebetween,
• wherein the first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors, and
• a horizontal length of the first groove is 30% or more to 50% or less of a horizontal length of the stacked ceramic capacitors, and
• wherein the first terminal structure includes:
• a first horizontal plate disposed on a lower surface of the stacked ceramic capacitor and spaced apart from a lower surface of the stacked ceramic capacitor;
• a first vertical plate having a first end portion connected to the first horizontal plate, bent in an upper direction where the stacked ceramic capacitor is disposed, and disposed so that a second end portion is under the stacked ceramic capacitor;
• a first extension plate extending upward from a second end portion of the first vertical plate and coming into contact with a first area of the first side surface of the stacked ceramic capacitor;
• and
• a second extension plate extending upward from the second end portion of the first vertical plate, spaced apart from the first extension plate, and coming into contact with a second area of the first side surface of the stacked ceramic capacitor, and
• the first groove is defined as a separation space between the first extension plate and the second extension plate, and is configured to expose a portion of the first side surface of the stacked ceramic capacitor.