Multilayer Component, Multilayer Component Assembly, and Methods for Forming a Multilayer Component

An assembly, comprising:

• a device having a device substrate and a ground defined on the device substrate;
• and
• a multilayer component attached to the device substrate, the multilayer component comprising:
• a plurality of dielectric layers including an outer dielectric layer, the plurality of dielectric layers stacked in a Z-direction to form a multilayer component substrate having a top and a bottom;
• a conductive layer formed over a respective one dielectric layer of the plurality of dielectric layers, the conductive layer disposed within the stacked plurality of dielectric layers such that the conductive layer is spaced apart from both the top and the bottom of the multilayer component substrate along the Z-direction;
• a shield layer formed over the outer dielectric layer;
• and
• a plurality of vias extending from the shield layer,
• wherein each via of the plurality of vias is electrically connected to the ground.

A method for forming a multilayer component, the method comprising:

• forming a plurality of dielectric layers, the plurality of dielectric layers including an outer dielectric layer;
• forming a conductive layer, the conductive layer formed from a conductive material disposed over a respective one dielectric layer of the plurality of dielectric layers;
• forming a shield layer, the shield layer formed from the conductive material disposed over the outer dielectric layer;
• stacking the plurality of dielectric layers in a Z-direction to form a substrate;
• and
• defining a plurality of vias along the perimeter of the substrate,
• wherein the plurality of vias extend from the shield layer to an outer surface of the substrate opposite the shield layer along the Z-direction.