H01G 13/003
Apparatus or processes for encapsulating capacitors
Official title: {Apparatus or processes for encapsulating capacitors}
H01G13/003 (Apparatus or processes for encapsulating capacitors) appears on 57 US grants and 75 published applications in this corpus.
Search patents in H01G- Granted patents
- 57
- Published applications
- 75
- Assignees
- 48
- Inventors
- 186
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 1 | 3 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 3 |
| 2015 | 3 | 6 |
| 2016 | 5 | 9 |
| 2017 | 3 | 2 |
| 2018 | 4 | 2 |
| 2019 | 1 | 3 |
| 2020 | 3 | 4 |
| 2021 | 1 | 4 |
| 2022 | 4 | 8 |
| 2023 | 4 | 6 |
| 2024 | 11 | 3 |
| 2025 | 4 | 6 |
| 2026 | 1 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film capacitor having a terminal electrode including a substrate connector, and method for producing film capacitor22 Sep 2026US 12,744,161 B2Murata Manufacturing Co., Ltd.
- Multilayer electronic component and method of manufacturing multilayer electronic component12 Aug 2025US 12,387,879 B2Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing electronic component22 Jul 2025US 12,369,254 B2Murata Manufacturing Co., Ltd.
- Negative-pressure packaging method for aluminum electrolytic capacitor17 Jun 2025US 12,334,275 B2Capxon Electronic Technology Co., Ltd
- Systems and methods for patterning valve metals14 Jan 2025US 12,198,855 B1The Florida International University Board of Trustees
- Multilayer electronic device and method of manufacturing the same24 Sep 2026US 2026/0290696 A1TDK Corporation
- Multilayer ceramic electronic component and method for manufacturing the same3 Sep 2026US 2026/0260811 A1Taiyo Yuden Co., Ltd.
- Method for manufacturing multilayer electronic component27 Aug 2026US 2026/0253814 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component2 Jul 2026US 2026/0188582 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component25 Jun 2026US 2026/0179844 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Vanadium-containing film forming compositions and vapor deposition of vanadium-containing films474US 9,691,771 B2L Air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation des Procedes Georges Claude · 2017
- Manganese oxide capacitor for use in extreme environments20US 8,947,857 B2AVX Corporation · 2015
- Tantalum capacitor with polymer cathode12US 10,062,519 B2Kemet Electronics Corporation · 2018
- Method for encapsulating electrical components11US 4,045,867 ATelefonaktiebolaget L M Ericsson · 1977
- ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device7US 11,633,612 B2Greatbatch Ltd. · 2023